EMAP2012 Opening Presentation
EMAP2012 Final Program
The 14th International Conference on Electronics Materials And Packaging (EMAP2012) will be held at Novotel Hong Kong Citygate, Lantau Island, Hong Kong, on December 13–16, 2012. The former conferences were held in Singapore (1999/2003/2010), Hong Kong (2000/2006), Korea (2001/2007), Taiwan (2002/2008), Malaysia (2004/2009) and Japan (2005/2011) all of which were successful and have gained a reputation as a premier electronics materials and packaging conference.
Continuing the great initiative and momentum of the past EMAPs, especially the 2nd and 8th EMAP (EMAP2000/2006) held in Hong Kong, we aim to strengthen R&D activities on electronic materials and packaging technologies in Asia and other regions in the world, to bridge academic scholars with industrial researchers, and to promote EMAP as a major international forum in this increasingly important area.
The purpose of the conference is to promote awareness of new advances in materials, design and simulations, fabrication, reliability, and thermal management of microsystem/MEMS packages. Also, the technical program will include invited and contributed presentations on theoretical, numerical, and experimental work of electronic materials and packaging. Technical short courses will also be arranged.
The conference will include all fundamental and applied sciences and technologies related to the fields of electronic materials, devices, and packaging. Topics may include from, but are not limited to, the following areas:
- Materials and Processing
- Passive and Active Components
- Optoelectronics / Photonics
- Sensor, Actuator, and Transducer Technologies
- Advanced Packaging
- Emerging Packaging Technologies
- Interconnection Technologies
- System-in-Package (SiP) and 3D Stacked Die Packaging
- Electrical Modeling, Characterization, and Signal Integrity
- Thermal-Mechanical Modeling and Characterization
- Packaging Technologies for High Brightness LEDs
- Quality and Reliability